SikoBV | UV curing & light activated epoxy adhesives

DELO supplies a great variety of light-curing and UV-curing epoxy resins. The product range includes adhesives for complex automotive and optoelectronic applications, chip encapsulates for fast in-line processes (Dam&Fill), encapsulates with a high water barrier effect for organic electronics, and many more. Thanks to their high transparency and their thermal stability, the materials can also be used in the production of optical components. Further important properties include low shrinkage during polymerization, low out gassing, good chemical resistance, and high ion purity. The special feature of DELO’s products is that they can be preactivated. Therefore, it is also possible to use DELO® KATIOBOND® to bond opaque materials.

Properties

Application areas

  • Activation within seconds for short cycle times in production
  • Suitable for opaque materials
  • Wide temperature range of use
  • Automotive
  • Displays
  • Optoelectronics
  • Semiconductor packaging
  • Smart card / RFID

Further application areas

  • Electronics | Organic electronics

Product

Viscosity

 

(mPas)

Compression shear strength (MPa)

Tensile strength

(MPa)

Characteristics

glass /glass

glass /Al

glass /FR4

4552

1.200

24

17

27

24

Good flow behavior, hard composite, fast curing

KB554

1.500

31

22

21

16

Good flow behavior, tough-elastic, tension-equalizing, fast curing

4557

3.500

10

9

14

6

Good flow behavior, tough-hard

4578

12.400 thix

27

20

20

21

Medium-viscous, hard composite, fast curing

4591

23.000 thix

20

15

19

8

Medium-viscous, tough-elastic, tension-equalizing

4594

32.000 thix

25

20

18

31

Fills gaps, hard composite, fast curing

45952

32.000 thix

30

13

19

18

Fills gaps, tough-elastic, tension-equalizing

4597

48.000 thix

10

10

11

4

Fills gaps, tough-hard

AD640

9.000 thix

22

16

20

45

Medium-viscous, very fast build-up of adhesion, very good chemical resistance, low water absorption, low ion content, very low out gassing

OB642

9.500

23

16

12

46

Fast build-up of adhesion, high TG, high optical transparency and yellowing resistance

4670

4.800

35

10

35

30

Good flow behavior, low water absorption, very low ion content, chip encapsulation compound

DF698

180.000 thix

28

12

23

32

Very steady, low water absorption, very low ion content, Dam for chip encapsulation compounds

OB678

60.000

15

11

12

37

Fast build-up of adhesion, good adhesion and humidity resistance on stainless steel

Other adhesive products in the DELO® KATIOBOND® serie are:
4653, GE680, LP655, LP686, OB665