DELO supplies a great variety of light-curing and UV-curing epoxy resins. The product range includes adhesives for complex automotive and optoelectronic applications, chip encapsulates for fast in-line processes (Dam&Fill), encapsulates with a high water barrier effect for organic electronics, and many more. Thanks to their high transparency and their thermal stability, the materials can also be used in the production of optical components. Further important properties include low shrinkage during polymerization, low out gassing, good chemical resistance, and high ion purity. The special feature of DELO’s products is that they can be preactivated. Therefore, it is also possible to use DELO® KATIOBOND® to bond opaque materials.
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Properties |
Application areas |
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Further application areas
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Product |
Viscosity
(mPas) |
Compression shear strength (MPa) |
Tensile strength (MPa) |
Characteristics |
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glass /glass |
glass /Al |
glass /FR4 |
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4552 |
1.200 |
24 |
17 |
27 |
24 |
Good flow behavior, hard composite, fast curing |
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KB554 |
1.500 |
31 |
22 |
21 |
16 |
Good flow behavior, tough-elastic, tension-equalizing, fast curing |
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4557 |
3.500 |
10 |
9 |
14 |
6 |
Good flow behavior, tough-hard |
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4578 |
12.400 thix |
27 |
20 |
20 |
21 |
Medium-viscous, hard composite, fast curing |
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4591 |
23.000 thix |
20 |
15 |
19 |
8 |
Medium-viscous, tough-elastic, tension-equalizing |
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4594 |
32.000 thix |
25 |
20 |
18 |
31 |
Fills gaps, hard composite, fast curing |
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45952 |
32.000 thix |
30 |
13 |
19 |
18 |
Fills gaps, tough-elastic, tension-equalizing |
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4597 |
48.000 thix |
10 |
10 |
11 |
4 |
Fills gaps, tough-hard |
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AD640 |
9.000 thix |
22 |
16 |
20 |
45 |
Medium-viscous, very fast build-up of adhesion, very good chemical resistance, low water absorption, low ion content, very low out gassing |
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OB642 |
9.500 |
23 |
16 |
12 |
46 |
Fast build-up of adhesion, high TG, high optical transparency and yellowing resistance |
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4670 |
4.800 |
35 |
10 |
35 |
30 |
Good flow behavior, low water absorption, very low ion content, chip encapsulation compound |
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DF698 |
180.000 thix |
28 |
12 |
23 |
32 |
Very steady, low water absorption, very low ion content, Dam for chip encapsulation compounds |
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OB678 |
60.000 |
15 |
11 |
12 |
37 |
Fast build-up of adhesion, good adhesion and humidity resistance on stainless steel |
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Other adhesive products in the DELO® KATIOBOND® serie are: |
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